Passive Trimming
The resistance or a voltage parameter is monitored while a high-powered laser removes material from a resistor to increase its value.
Active Trimming
Material from a resistor is removed or one or more fuses are blown to change a circuit parameter while the circuit is in functional mode during the trimming process.
Capabilities:
Thin film and thick film.
Tight tolerance of ratio targeting or value matching.
Active guarding for closed-loop resistors.
Thermistor/Platinum RTD trimming with matching with reference temperature sensor.
Trimming of resistors printed on alumina, dielectric layers, aluminum nitrate, polyimide and other materials.
Custom application software written in-house.
Thick-film probe cards assembled in-house.
Spot Size:
For thick film products, our laser spot size typically ranges from 25 to 75 microns.
For thin film and silicon wafer products, our laser spot size typically ranges from 6 to 10 microns.